With the rapid development of electronic technology, micro-nano manufacturing processes are increasingly being widely adopted in microfabrication technology. During processing, when high-density, high-energy plasma bombards and erodes aluminum alloys, quartz, ceramics, and other components, particulate contamination is generated. These contaminating particles can significantly impact product quality and yield, shortening the lifespan of production equipment components. Simultaneously, non-volatile fluorides generated during microfabrication can deposit on the surface of electronic components, causing defects or even rendering them unusable. Therefore, plasma resistance is crucial for components in electronic manufacturing equipment. Currently, yttrium oxide is widely used in ceramic surface coatings due to its excellent physical and chemical properties to reduce the possibility of electronic components being contaminated.
Advantages of applying a yttrium oxide coating:
(1) The removal of aluminum fluoride after applying a yttrium oxide coating reduces contaminant particles on the product surface;
(2) The low transition metal content in yttrium oxide reduces the risk of contamination of internal components by metals such as K, Na, Fe, Cu, and Ni;
(3) Yttrium oxide has superior dielectric properties, and the thicker the coating, the stronger its resistance to dielectric breakdown;
(4) As a plasma-resistant component material, yttrium oxide exhibits a low corrosion rate in plasma;
(5) The yttrium oxide coating possesses excellent heat resistance, wear resistance, and insulation properties, enhancing the applicability of ceramic products in the field of electronic engineering.